NURBS-based solutions to inverse boundary problems in droplet shape prediction

Computer Methods in Applied Mechanics and Engineering

Volumn 190, Issue 11-12, 2000, Pages 1391-1406

  Renken, F P ^a   Subbarayan, G ^a  

^a UCB 450   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; INTEGRATION; INVERSE PROBLEMS;

THREE DIMENSIONAL DROPLET SHAPE PREDICTION;

BOUNDARY VALUE PROBLEMS;

EID: 0034517042     PISSN: 00457825     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0045-7825(00)00168-7     Document Type: Article

References (12)

1. F.P. Renken, G. Subbarayan, A two-body formulation for solder joint shape prediction, J. Electron. Packag. 120 (3) (1998) 302.
2. S.M. Heinrich, P.S. Lee, Solder geometry prediction in electronic packaging: an overview, in: Advances in Electronic Packaging, vol. 19-2, 1997, p. 1371.
3. G. Subbarayan, A procedure for automated shape and life prediction in flip-chip and BGA solder joints, ASME J. Electron. Packag. 118 (1996) 127-133.
4. K. Brakke, The surface evolver, Exp. Math. 1 (2) (1992) 141-165.
5. S.M. Heinrich, A.F. Elkouh, N.J. Nigro, P.S. Lee, Solder joint formation in surface mount technology - part I: Analysis, ASME J. Electron. Packag. 112 (1990) 210-218.
6. L. Piegl, W. Tiller, The NURBS Book, Springer, Berlin, 1995.
7. Carderock Division Naval Surface Warfare Center, David Taylor Model Basin Bethesda MD, DT_NURBS Spline Geometry Subprogram Library User's Manual 3.3, 1996.
8. W.H. Press, S.A. Teukolsky, W.T. Vetterling, B.P. Flannary, Numerical Recipes in C, second ed., Cambridge University Press, Cambridge, 1995.
9. K. Schittkowski, NLPQL: A FORTRAN subroutine solving constrained nonlinear programming problems, Ann. Oper. Res. 5 (1985) 485.
10. C.K. Au, M.M.F.Yuen, Unified approach to NURBS curve shape modifcation, Computer Aided Design 27 (2) (February 1995) 85.
11. J.J. More, B.S. Grabow, K.E. Hillstrom, User Guide for MINPACK-1, Argonne national Laboratory Report ANL-80-74, 1980, can be found in netlib on internet.
12. H.C. Choi, Y. Guo, W. LaFontaine, C.K. Lim, Solder ball connect (SBC) assemblies under thermal loading: 2. strain analysis via image processing and relieability considerations, IBM J. Res. Develop. 37 (5) (1993) 649-659.