Influence of processing method on the grain boundary character distribution and network connectivity

Materials Research Society Symposium - Proceedings

Volumn 586, Issue , 2000, Pages 3-14

  Schwartz, Adam J ^a   Kumar, Mukul ^a   King, Wayne E ^a  

^a LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CHARACTERIZATION; COMPACTION; COPPER; ELECTRON DIFFRACTION; MICROSTRUCTURE; ROLLING; THERMAL EFFECTS; THERMOMECHANICAL TREATMENT;

DEFORMATION PATH; ELECTRON BACKSCATTER DIFFRACTION; FACE CENTERED CUBIC MATERIALS; GRAIN BOUNDARY CHARACTER DISTRIBUTION; NETWORK CONNECTIVITY; OXYGEN FREE ELECTRONIC COPPER; SEQUENTIAL PROCESSING; THERMOMECHANICAL PROCESSING;

GRAIN BOUNDARIES;

EID: 0034506723     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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