The potential engineering of grain boundaries through thermomechanical processing

JOM

Volumn 50, Issue 2, 1998, Pages 50-55

  Schwartz, Adam J ^a,b   King, Wayne E ^b,c  

^a UNIVERSITY OF PITTSBURGH   (United States)

^b LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

^c NORTHWESTERN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRON DIFFRACTION; PROCESS ENGINEERING; SCANNING ELECTRON MICROSCOPY;

THERMOMECHANICAL PROCESSING;

GRAIN BOUNDARIES;

EID: 0031996533     PISSN: 10474838     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11837-998-0250-5     Document Type: Article

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