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Volumn 87, Issue 1-2, 2000, Pages 46-51
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High aspect-ratio polysilicon micromachining technology
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Author keywords
[No Author keywords available]
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Indexed keywords
ASPECT RATIO;
DRY ETCHING;
ENERGY GAP;
MICROELECTRODES;
MICROELECTROMECHANICAL DEVICES;
MICROSTRUCTURE;
MULTILAYERS;
POLYSILICON;
SILICON WAFERS;
THERMODYNAMIC STABILITY;
AIR GAPS;
ELECTRICALLY ISOLATED POLYSILICON;
POLYSILICON MICROMACHING TECHNOLOGY;
TEMPERATURE SENSITIVITY;
MICROMACHINING;
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EID: 0034505170
PISSN: 09244247
EISSN: None
Source Type: Journal
DOI: 10.1016/S0924-4247(00)00452-0 Document Type: Article |
Times cited : (37)
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References (7)
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