Electromigration characterization versus texture analysis in damascene copper interconnects

Materials Research Society Symposium-Proceedings

Volumn 612, Issue , 2000, Pages D241-D246

  Arnaud, L ^a   Touet, I ^a   Berger, T ^b   Gonella, R ^b   Lormand, G ^c  

^a CEA GRENOBLE   (France)

^b STMICROELECTRONICS   (France)

^c UNIVERSITÉ DE LYON   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; DIFFUSION; ELECTROMIGRATION; ELECTROPLATING; FAILURE ANALYSIS; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; ION BEAMS; METALLIZING; SCANNING ELECTRON MICROSCOPY; TEXTURES; X RAY DIFFRACTION ANALYSIS;

DAMASCENE INTERCONNECTS;

COPPER COMPOUNDS;

EID: 0034431071     PISSN: 02729172     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)