An experimental study on tool wear of hydrodynamic polishing process

Wear

Volumn 246, Issue 1-2, 2000, Pages 117-129

  Su, Yaw Terng ^a   Hung, Tu Chieh ^a   Horng, Chuen Chyi ^b  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^b Chinese Miltary Academy   (Taiwan)

Author keywords

Hydrodynamic polishing process; Tool wear

Indexed keywords

CHEMICAL POLISHING; ELASTOHYDRODYNAMIC LUBRICATION; HYDRODYNAMICS; INTERFACES (MATERIALS); WEAR OF MATERIALS;

HYDRODYNAMIC POLISHING PROCESS;

MACHINE TOOLS;

HYDRODYNAMICS; LUBRICATION; POLISHING; TOOL WEAR; WEAR MEASUREMENT;

EID: 0034325150     PISSN: 00431648     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0043-1648(00)00497-X     Document Type: Article

References (16)

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5. On machining rate of hydrodynamic polishing process under semi-contact lubricating condition
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7. Analysis of flow between a wafer and pad during CMP processes
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10. 2-films
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14. Investigate of pad deformation and condition during the CMP of silicon dioxide films