Metal dissolution kinetics in aluminum etch tunnels

Journal of the Electrochemical Society

Volumn 147, Issue 11, 2000, Pages 4103-4110

  Tak, Yongsug ^a,b   Sinha, Nishant ^a,c   Hebert, Kurt R ^a  

^a Iowa State University   (United States)

^b Inha University   (South Korea)

^c MICRON TECHNOLOGY INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CURRENT DENSITY; DISSOLUTION; ETCHING; REACTION KINETICS; SCANNING ELECTRON MICROSCOPY; SODIUM CHLORIDE;

ANODIC PULSE; DISSOLVED DEPTH; ETCH TUNNELS; POTENTIAL DROPS;

ELECTROCHEMICAL CORROSION;

EID: 0034321511     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1394026     Document Type: Article

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