Repassivation of pits in aluminum thin films

Journal of the Electrochemical Society

Volumn 143, Issue 6, 1996, Pages 1834-1840

  Frankel, G S ^a,c,d   Scully, J R ^b,c   Jahnes, C V ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b University of Virginia   (United States)

^c ELECTROCHEMICAL SOCIETY

^d Ohio State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CHLORINE COMPOUNDS; CRITICAL CURRENT DENSITY (SUPERCONDUCTIVITY); DISSOLUTION; ELECTRIC RESISTANCE; MASS TRANSFER; PASSIVATION; PITTING; SOLUTIONS; SPUTTER DEPOSITION; STABILITY;

FILM THICKNESS; OHMIC RESISTANCE; PITS; REPASSIVATION;

THIN FILMS;

EID: 0030173325     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1836912     Document Type: Article

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