Fabrication of semiconductor optical switch module using laser welding technique

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 4, 2000, Pages 672-680

  Kang, Seung Goo ^a,b   Song, Min Kyu ^a,c   Park, Seong Su ^a,c   Lee, Sang Hwan ^c   Hwang, Nam ^a,c   Lee, Hee Tae ^c   Oh, Kwang Ryong ^a,c   Joo, Gwan Chong ^c   Lee, Donghan ^d  

^a IEEE

^b XL Photonics Inc   (South Korea)

^c Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

^d Chungnam National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

DEGRADATION; ELECTRONICS PACKAGING; LASER BEAM WELDING; OPTICAL COMMUNICATION; OPTICAL SWITCHES; THERMAL CYCLING; THERMODYNAMIC STABILITY;

LASER HAMMERING TECHNIQUE; PIN BUTTERFLY PACKAGE; SEMICONDUCTOR OPTICAL SWITCH MODULES; TAPERED FIBER ARRAY;

OPTICAL FIBER FABRICATION;

EID: 0034315243     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.883757     Document Type: Article

References (11)

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