Effect of Au coating on joint strength in laser welding for invar-invar packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 942-945

  Wang, S C ^a   Wang, C ^a   Tu, Y K ^a   Hwang, C J ^a   Chi, S ^a   Wang, W H ^a   Cheng, W H ^a  

^a CHUNGHWA TELECOM CO LTD   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); COATINGS; ELECTRONICS PACKAGING; GOLD; NEODYMIUM LASERS; RELIABILITY; THERMAL CONDUCTIVITY; THERMAL EXPANSION; THERMAL STRESS; THICKNESS CONTROL; VAPORS; WELDS;

GOLD COATING; INVAR-INVAR PACKAGE;

LASER BEAM WELDING;

EID: 0029697099     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (4)