Enabling MEMS package-device co-design through extraction of compact models

American Society of Mechanical Engineers, EEP

Volumn 26, Issue , 1999, Pages

  Bart, Stephen F ^b   Zhang, Susan ^b   Rabinovich, Vladimir ^b   Van Kuijk, Joost ^a,b   Da Silva, Mark ^b  

^a Microcosm Technologies BV   (Netherlands)

^b Microcosm Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COMPUTER SIMULATION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MICROELECTROMECHANICAL DEVICES; SURFACE MOUNT TECHNOLOGY;

PLASTIC SURFACE MOUNT PACKAGES;

ELECTRONICS PACKAGING;

EID: 0342733369     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. S.F. Bart and J.R. Gilbert, "Integrating Packaging into the MEMS Sensor Design Process", Proceedings of Sensor Expo, Chicago, IL, October 6-8 1998, pp. 469-472.
2. A.C. McNeil, "A Parametric Method for Linking MEMS Package and Device Models", Proceedings of the Solid-State Sensors and Actuators Workshop, Hilton Head Is. SC, June 8-11 1998, pp. 166-169.
3. MEMCAD 4 User Guide, Microcosm Technologies, Inc., 1998.
4. S.F. Bart and H.R. Samuels, "Design Techniques for Minimizing Manufacturing Variations in Surface Micromachined Accelerometers", Mems, ASME Press, DCS-Vol. 59, pp.427-433.
5. F. Pan, et al., "Design, Modeling and Verification of a MEMS Silicon Torsion Mirror for Applications in Xerography", Proceedings of SPIE Micromachined Devices and Components conference, Austin TX, September 29-30 1997.
6. G.X. Li, et al., "Stress-Induced Warpage and the Compensation in a Composite Micro-Accelerometer", Proceedings of SPIE Micromachined Devices and Components conference, Austin TX, October 14-15 1996, pp 147-151.
7. V.M. Aleksandrov, et al., "Strain-Gauge Measurement Error for Parts Fabricated from Low-Modulus Materials", Mechanics of Solids, Vol. 23, pp. 108-112, (1988).