Mechanism of reduction of columnar dendrite spacing in unidirectional solidification caused by electric current passing through solid-liquid interface

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 10, Issue 5, 2000, Pages 610-613

  Chang, Guo Wei ^a   Yuan, Jun Ping ^b   Wang, Zi Dong ^b   Wu, Chun Jing ^b   Wang, Xin Hua ^b   Hu, Han Qi ^b  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

^b LIAONING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Columnar dendrite spacing; Cu al alloy; Mechanism of current effect; Unidirectional solidification

Indexed keywords

COPPER ALLOYS; ELECTRIC CURRENTS; INTERFACES (MATERIALS); SOLIDIFICATION; STABILITY;

COLUMNAR DENDRITE SPACING; SOLID LIQUID INTERFACE; UNIDIRECTIONAL SOLIDIFICATION;

ELECTROSLAG REMELTING;

EID: 0034309639     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

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