Mechanism of dendrite armapace of unidirectional solidification single-phase alloy with influence of electric current

Beijing Keji Daxue Xuebao/Journal of University of Science and Technology Beijing

Volumn 21, Issue 2, 1999, Pages 175-178

  Chang, Guowei ^a   Yuan, Junping ^a   Wang, Zidong ^a   Hu, Hanqi ^a   Xue, Qingguo ^b  

^a Material Science and Engineering School   (China)

^b Meiallurgy Engineering School

Author keywords

Interface stability kinetics; Microstructure morphology; Unidirectional solidification

Indexed keywords

EID: 0037649490     PISSN: 1001053X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)

1. Holzgruber W. In:Bhat G K. Simkovichi A,eds. Parc the Fifth Int Syznp on Electroslag and Other Special Melting Technol. Carnegie-Mellon Inst of Research, 1974.70
2. Mullins W W, Sekerka P. F. Stability of a Planar Interface during Solidification of a Dilute Binary Alloy. J Applied Phys, 1964,35:444.