Effect of electric current on stability of solidification interface morphology

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 10, Issue 4, 2000, Pages 445-448

  Chang, Guo Wei ^a,b   Yuan, Jun Ping ^c   Wang, Zi Dong ^a   Wu, Chun Jing ^a   Wang, Xin Hua ^a   Hu, Han Qi ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

^b LIAONING UNIVERSITY OF TECHNOLOGY   (China)

^c Guangzhou Research Institutes of Nonferrous Metals   (China)

Author keywords

Cu Al alloy; Interface; Morphology; Stability; Unidirectional solidification

Indexed keywords

COPPER ALLOYS; ELECTRIC CURRENTS; INTERFACES (MATERIALS); MORPHOLOGY; SOLIDIFICATION; STABILITY;

SOLID LIQUID INTERFACE; UNIDIRECTIONAL SOLIDIFICATION;

CRYSTAL GROWTH;

EID: 0034240549     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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