Conductive adhesive materials for lead solder replacement

IEEE International Symposium on Polymeric Electronics Packaging, PEP

Volumn , Issue , 1997, Pages 76-79

  Suzuki, Kenichi ^a   Suzuki, Osamu ^a   Komagata, Mitinori ^a  

^a NAMICS CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE MATERIALS; CURRENT VOLTAGE CHARACTERISTICS; ELECTROMIGRATION; OHMIC CONTACTS; SOLDERING; SOLDERING ALLOYS; TIN SMELTING;

ELECTRICALLY CONDUCTIVE ADHESIVES; LEAD SOLDER REPLACEMENTS;

ADHESIVES;

EID: 0031364728     PISSN: 14029855     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)