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Microelectronics Journal

Volumn 31, Issue 8, 2000, Pages 701-709

Electrical modeling of the chip scale ball grid array package at radio frequencies

(4) Caggiano, M F a Barkley, E a Sun, M a Kleban, J T a

a RUTGERS UNIVERSITY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COMPUTER SOFTWARE; ELECTRIC NETWORK TOPOLOGY; MICROELECTRONIC PROCESSING; SEMICONDUCTOR DEVICE MODELS; SKIN EFFECT; SOFTWARE ENGINEERING;

CHIP SCALE BALL GRID ARRAY PACKAGE; SOFTWARE PACKAGE SPICE;

ELECTRONICS PACKAGING;

EID: 0034248754 PISSN: 00262692 EISSN: None Source Type: Journal
DOI: 10.1016/S0026-2692(00)00047-1 Document Type: Article

Times cited : (6)

References (10)

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2
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4
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