Fracture of copper-based leadframe/EMC interfaces

Metals and Materials International

Volumn 6, Issue 4, 2000, Pages 317-322

  Lee, Ho Young ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Cu based leadframe; Epoxy molding compound; Failure path; Fracture toughness; Loading condition

Indexed keywords

ATOMIC FORCE MICROSCOPY; CANTILEVER BEAMS; COPPER; COPPER OXIDES; ELECTRONICS PACKAGING; FRACTURE MECHANICS; FRACTURE TOUGHNESS; MOLDING; OXIDE MINERALS; SHEET MOLDING COMPOUNDS;

COPPER-BASED LEADFRAME; DOUBLE CANTILEVER BEAM; EPOXY MOLDING COMPOUNDS; FAILURE PATHS; LEAD-FRAME; LOADING CONDITION; MIXED-MODE LOADING; SURFACE CONDITIONS;

LOADING;

EID: 0034238888     PISSN: 12259438     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF03028078     Document Type: Article

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