Assembly-level reliability characterization of chip-scale packages

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 482-494

  Lall, P ^a   Banerji, K ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTOMERS; FAILURE (MECHANICAL); NETWORK COMPONENTS; SOLDERING ALLOYS; THERMAL AGING; THERMAL FATIGUE; AGING OF MATERIALS; COMPUTER SIMULATION; DATA STORAGE EQUIPMENT; DEFORMATION; FAILURE ANALYSIS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; HUMIDITY CONTROL; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT TESTING; MATHEMATICAL MODELS; SUBSTRATES;

ACCELERATED TESTS; ASSEMBLY LEVELS; FAILURE MECHANISM; MODEL PREDICTION; NON-LINEAR FINITE ELEMENT MODEL; OUT-OF-PLANE DEFORMATIONS; RELIABILITY CHARACTERIZATION; RIGID SUBSTRATES;

CHIP SCALE PACKAGES; ELECTRONICS PACKAGING;

CHIP SCALE PACKAGES (CSP); PLASTIC BALL GRID ARRAYS (PBGA) PACKAGES; THERMAL AGING;

EID: 0031645694     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678738     Document Type: Conference Paper

References (6)

1. P. Lall, G. Gold, B. Miles, K. Banerji, P. Thompson, C. Koehler, I. Adhihetty, "Reliability Characterization of the SLICC Package", Electronic Components and Technology Conference (ECTC1 Orlando, Florida, May 28-31, pp. 1202-1210, 1996
2. P. Lall, M. Pecht, E. Hakim, "Influence of Temperature on Microelectronic and System Reliability"'. CRC Press, Boca Raton, Florida, 1997.
3. K. Banerji and R. Darveaux, "Effect of Aging on the Strength of and Ductility of Controlled Collapse Solder Joints", in First Intl. Conf. on Micros. & Mech. Prop, of Aging Mater. TMS, Warrendale, PA, 1993.
4. E. Bradley, P. Lall, K. Banerji, "Effect of Thermal Aging on the Microstructure and Reliability of Ball Grid Array (BGA) Solder Joints", in Proc. Surf. Mount Intl. 1996. September 8-12, 1996, pp. 95-106
5. R. Mahidhara, V. Solberg, T. DiStefano, S. Greathouse, "Solder Joint Integrity in Tessera's |iBGA Package", in Design and Reliability of Solders and Solder Interconnections. TMS, Warrendale, PA, 1997, 403-412.
6. Darveaux, R., K. Banerji, A. Mawer, G. Dody, "Reliability of Plastic Ball Grid Array Assembly", Chapter 13, pp. 380-442, Ball Grid Array Technology, edited by John Lau, McGraw Hill, Inc., 1994.