Integration of metal masking and etching for deep submicron patterning

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 18, Issue 4, 2000, Pages 1420-1424

  Gabriel, Calvin T ^a   Kim, Robert Y ^a   Baker, Daniel C ^a  

^a NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COPPER; PHOTORESISTS;

COPPER DAMASCENE INTERCONNECTS; DEEP ULTRAVIOLET (DUV) PHOTOLITHOGRAPHY;

PLASMA ETCHING;

EID: 0034227483     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.582364     Document Type: Article

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