Preparation and characterization of platinum black electrodes

Journal of Materials Science

Volumn 35, Issue 14, 2000, Pages 3447-3457

  Ilic, B ^a,d   Czaplewski, D ^a,d   Neuzil, P ^b   Stanczyk, T ^a,e   Blough, J ^c   Maclay, G J ^a  

^a UNIVERSITY OF ILLINOIS AT CHICAGO   (United States)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

^c 1120 Science and Engineering Offices   (United States)

^d Cornell University   (United States)

^e MOLEX INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ANNEALING; ATOMIC FORCE MICROSCOPY; CURING; CURRENT DENSITY; ELECTROCHEMISTRY; ELECTRODEPOSITION; METALLIC FILMS; MORPHOLOGY; PLATINUM; SCANNING ELECTRON MICROSCOPY; SURFACE ROUGHNESS;

PLATINUM BLACK ELECTRODES; PLATINUM FILM; TAPPING MODE ATOMIC FORCE MICROSCOPY;

ELECTROCHEMICAL ELECTRODES;

EID: 0034227214     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1004884723515     Document Type: Article

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