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Pure DCM causes undercutting of the PDMS leading to the separation of the MSB into two halves. Using an epoxy resin to bond the device instead of PDMS was found to greatly increase its resistance to harsh solvents
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Pure DCM causes undercutting of the PDMS leading to the separation of the MSB into two halves. Using an epoxy resin to bond the device instead of PDMS was found to greatly increase its resistance to harsh solvents.
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15
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0001471062
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0343969530
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-2 (see ref 15). It is likely that there is some residual solvent in the layers formed upon the MSB thus reducing the measured capacitance
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-2 (see ref 15). It is likely that there is some residual solvent in the layers formed upon the MSB thus reducing the measured capacitance.
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18
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0029038564
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