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Volumn 39, Issue 6 A, 2000, Pages 3319-3325
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Compositional changes of SiC/Si structure during vacuum annealing
a b a |
Author keywords
Carbon layer; Composition; Crack; Cubic SiC film; Defect; Gasification; Hollow void; Hydrogen plasma; Shrinking; Si substrate; Vacuum annealing
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Indexed keywords
AMORPHOUS FILMS;
ANNEALING;
CRACKS;
CRYSTALLIZATION;
GASIFICATION;
SEMICONDUCTING SILICON COMPOUNDS;
SHRINKAGE;
SILICON CARBIDE;
SILICON WAFERS;
STRESS ANALYSIS;
THERMAL EFFECTS;
VACUUM APPLICATIONS;
VACUUM ANNEALING;
SEMICONDUCTING FILMS;
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EID: 0034204666
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/jjap.39.3319 Document Type: Article |
Times cited : (6)
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References (11)
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