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Volumn 37, Issue 12, 1997, Pages 56-58,-60,-62
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Ultra fine pitch wire bond PBGAs
a
a
IBM
(United States)
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Author keywords
[No Author keywords available]
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Indexed keywords
ASSEMBLY;
COST EFFECTIVENESS;
PRINTED CIRCUIT BOARDS;
PRINTED CIRCUIT MANUFACTURE;
RELIABILITY;
TECHNOLOGY;
PLASTIC BALL GRID ARRAY;
THERMOCOMPRESSION BONDING;
ULTRAFINE PITCH WIRE BONDING;
ELECTRONICS PACKAGING;
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EID: 0031232259
PISSN: 00134945
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (4)
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References (0)
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