Diffusion model to derate moisture sensitive surface mount ICs for factory use conditions

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1995, Pages 440-449

  Shook, Richard L ^a   Conrad, Timothy R ^a   Sastry, V Srirama ^a   Steele, David B ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DIFFUSION IN SOLIDS; ELECTRONICS PACKAGING; MATHEMATICAL MODELS; MOISTURE; PLASTICS APPLICATIONS; SURFACE MOUNT TECHNOLOGY;

MOISTURE SENSITIVITY; PLASTIC PACKAGED BALL GRID ARRAY PACKAGES; PLASTIC QUAD FLAT PACK;

INTEGRATED CIRCUIT TESTING;

EID: 0029228960     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)