A Silicon-Based, Three-Dimensional Neural Interface: Manufacturing Processes for an Intracortical Electrode Array

IEEE Transactions on Biomedical Engineering

Volumn 38, Issue 8, 1991, Pages 758-768

  Campbell, Patrick K ^a   Jones, Kelly E ^a   Huber, Robert J ^a   Horch, Kenneth W ^a   Normann, Richard A ^a  

^a UNIVERSITY OF UTAH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRODES - ASSEMBLY; SENSORS - SILICON SENSORS; SENSORY AIDS - MANUFACTURE; THERMAL DIFFUSION;

INTRACONTICAL ELECTRODES; INTRACORTICAL SIMULATION; NEURAL INTERFACES; PENETRATING NEEDLES; THERMOMIGRATION;

BIOMEDICAL ENGINEERING;

ANIMAL EXPERIMENT; ARTICLE; BRAIN DEPTH STIMULATION; CAT; ELECTRODE; NONHUMAN;

ANIMAL; BIOCOMPATIBLE MATERIALS; CATS; ELECTRIC CONDUCTIVITY; ELECTRIC STIMULATION; ELECTRODES, IMPLANTED; MATERIALS TESTING; MICROSCOPY, ELECTRON, SCANNING; REPRODUCIBILITY OF RESULTS; SILICON; SOMATOSENSORY CORTEX; SUPPORT, U.S. GOV'T, NON-P.H.S.;

EID: 0026205082     PISSN: 00189294     EISSN: 15582531     Source Type: Journal    
DOI: 10.1109/10.83588     Document Type: Article

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