Advances in flip chip underfill material cure rates and reliability

Proceedings - 4th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn 1998-March, Issue , 1998, Pages 29-32

  Shi, Daqing Max ^a   McKeen, Kathy ^a   Jenson, Bill ^a  

^a Thermoset Plastics   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; CURING; DIFFERENTIAL SCANNING CALORIMETRY; GLASS TRANSITION; INTERFACES (MATERIALS); PACKAGING MATERIALS; RELIABILITY; THERMAL EXPANSION; FLIP CHIP DEVICES; MOISTURE DETERMINATION; PLASTICS FILLERS; SHEAR STRENGTH; TEMPERATURE; TEMPERATURE MEASUREMENT; TIME MEASUREMENT; VISCOSITY;

CURE TEMPERATURE; FUNCTION OF TIME; LINEAR COEFFICIENT OF THERMAL EXPANSION; MOISTURE ABSORPTION RATES; RELIABILITY DATA; SEMICONDUCTOR PACKAGING; THERMOMECHANICAL ANALYZERS; UNDERFILL MATERIALS;

FLIP CHIP DEVICES; ELECTRONICS PACKAGING;

COEFFICIENT OF THERMAL EXPANSION; CURE RATES; FLIP CHIP UNDERFILLS; MOISTURE ABSORPTION; THERMOMECHANICAL ANALYZER;

EID: 0032230670     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1998.664429     Document Type: Conference Paper

References (3)

1. Daqing Max Shi and James W. Carbin, "Advances in Flip Chip Underfill Flow and Cure Rates and their Enhancement of Manufacturing Processes and Component Reliability", Proceedings of 46th ECTC, (1996)
2. "Test Methods of Epoxy Compounds", ERF 13-70, Society of the Plastics Industry, Inc., Epoxy Resin Formulators Division.
3. J. Clementi, J. McCreary, T.M. Nui, J. Palomaki, J. Varcoe and G. Hill, "Flip Chip Encapsulation on Ceramic Substrates", Proceedings of 43rd ECTC, Orlando, FL. (1 993)