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Volumn 41, Issue 2, 1996, Pages 183-191
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Modelling the cure of a commercial epoxy resin for applications in resin transfer moulding
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Author keywords
Cure kinetics; Diffusion control; DSC; Glass transition temperature; Modelling; RTM epoxy
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Indexed keywords
ACTIVATION ENERGY;
ALGORITHMS;
AMINES;
CURING;
DIFFERENTIAL SCANNING CALORIMETRY;
DIFFUSION;
GLASS TRANSITION;
LEAST SQUARES APPROXIMATIONS;
MATHEMATICAL MODELS;
REACTION KINETICS;
REGRESSION ANALYSIS;
TRANSFER MOLDING;
DI BENEDETTO EQUATION;
MARQUARDT ALGORITHM;
RESIN TRANSFER MOULDING;
EPOXY RESINS;
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EID: 0030257958
PISSN: 09598103
EISSN: None
Source Type: Journal
DOI: 10.1002/(SICI)1097-0126(199610)41:2<183::AID-PI621>3.0.CO;2-F Document Type: Article |
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Times cited : (125)
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References (2)
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