3D Si-on-Si stack packaging

Soldering and Surface Mount Technology

Volumn 12, Issue 1, 2000, Pages 35-39

  Kanbach, H ^a   Wilde, J ^a   Kriebel, F ^b   Meusel, E ^c  

^a DAIMLER AG   (Germany)

^b KSW Microtec GmbH   (Germany)

^c DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; MULTICHIP MODULES; SEMICONDUCTING FILMS; SILICON WAFERS; STRAIN; STRESS ANALYSIS; SURFACE MOUNT TECHNOLOGY; THIN FILMS;

SILICON-ON-SILICON STACK PACKAGING;

ELECTRONICS PACKAGING;

EID: 0033899719     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910010312429     Document Type: Article

References (11)

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