Strain relief during metal-on-metal electrodeposition: A scanning tunneling microscopy study of copper growth on Pt(100)

Surface Science

Volumn 376, Issue 1-3, 1997, Pages 267-278

  Bittner, A M ^a,b   Wintterlin, J ^a   Ertl, G ^a  

^a FRITZ HABER INSTITUT DER MAX PLANCK GESELLSCHAFT   (Germany)

^b EPFL   (Switzerland)

Author keywords

Copper; Epitaxy; Metal electrolyte interfaces; Platinum; Scanning tunneling microscopy; Single crystal surfaces; Surface relaxation and reconstruction

Indexed keywords

COPPER; CYCLIC VOLTAMMETRY; DISLOCATIONS (CRYSTALS); ELECTRODEPOSITION; ELECTROLYTES; INTERFACES (MATERIALS); PLATINUM; SCANNING TUNNELING MICROSCOPY; SINGLE CRYSTALS; STRESS RELIEF; SURFACE PROPERTIES; SURFACE STRUCTURE;

STRAIN RELIEF; SURFACE RECONSTRUCTION;

FILM GROWTH;

EID: 0031117403     PISSN: 00396028     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0039-6028(96)01395-7     Document Type: Article

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