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Volumn 10, Issue 1, 2000, Pages 1-6

Electro-discharge machining of mesoscopic parts with electroplated copper and hot-pressed silver tungsten electrodes

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRODES; ELECTROPLATING; HOT PRESSING; SILVER COMPOUNDS;

EID: 0033881467     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/10/1/301     Document Type: Article
Times cited : (14)

References (12)
  • 2
    • 0027850644 scopus 로고
    • Behaviour of a silicon spring fabricated by wire electro-discharge machining
    • Staufert G, Dommann A and Lauger D 1993 Behaviour of a silicon spring fabricated by wire electro-discharge machining J. Micromech. Microeng. 3 232-5
    • (1993) J. Micromech. Microeng. , vol.3 , pp. 232-235
    • Staufert, G.1    Dommann, A.2    Lauger, D.3
  • 11
    • 0001479104 scopus 로고
    • Macroscopic plastic properties of dislocation-free germanium and other semiconductor crystals. I. Yield behaviour
    • Patel J R and Chaudhuri A R 1963 Macroscopic plastic properties of dislocation-free germanium and other semiconductor crystals. I. Yield behaviour J. Appl. Phys. 34 2788-99
    • (1963) J. Appl. Phys. , vol.34 , pp. 2788-2799
    • Patel, J.R.1    Chaudhuri, A.R.2
  • 12
    • 0027609536 scopus 로고
    • Design of sealed cavity microstructures formed by silicon wafer bonding
    • Huff M A, Nikolich A D and Schmidt M A 1993 Design of sealed cavity microstructures formed by silicon wafer bonding J. Micromech. Microeng. 2 74-81
    • (1993) J. Micromech. Microeng. , vol.2 , pp. 74-81
    • Huff, M.A.1    Nikolich, A.D.2    Schmidt, M.A.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.