Characteristic Impedance of Integrated Circuit Bond Wires

IEEE Transactions on Microwave Theory and Techniques

Volumn 34, Issue 9, 1986, Pages 982-984

  Caverly, Robert H ^a  

^a UNIVERSITY OF MASSACHUSETTS DARTMOUTH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000097438     PISSN: 00189480     EISSN: 15579670     Source Type: Journal    
DOI: 10.1109/TMTT.1986.1133480     Document Type: Article

References (10)

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2. T. C. Edwards, Foundations for Microstrip Circuit Design. New York: Wiley, 1981.
3. B. Lennartsson, “A network analogue method for computing the TEM characteristics of planar transmission line,” IEEE Trans. Microwave Theory Tech., vol. MTT-20, pp. 586–591, Sept. 1972.
4. R. Churchill, J. Brown, and R. Verhy, Complex Variables and Applications. New York: McGraw-Hill, 1974, pp. 72–83.
5. W. Hilberg, Electrical Characteristics of Transmission Lines. Dedham, MA: Artech House, 1979.
6. T. S. Saad, Ed.,Microwave Engineers Handbook, vol. 1. Dedham, MA: Artech House, 1971, p. 99.
7. G. Liebmann, “Solution of partial difference equations with a resistance network analogue,” British J. Appl. Phy., vol. 1, pp. 92–103, Apr. 1950.
8. L. Nagel, “SPICE 2: A computer program to simulate semiconductor circuits,” Rep. M520, Electronics Res. Laboratory, Univ. of California.
9. V. Belevich, “Capacitance of circuits in a tight screened pair or quad,” Philips Research Reps., vol. 33, pp. 139–148, 1978.
10. H. A. Wheeler, “Transmission-line properties of a round wire in a polygon shield,” IEEE Trans. Microwave Theory Tech., vol. MTT-27, pp. 717–721, Aug. 1979.