Parasitic Impedance Analysis of Double Bonding Wires for High-Frequency Integrated Circuit Packaging

IEEE Microwave and Guided Wave Letters

Volumn 5, Issue 9, 1995, Pages 296-298

  Yun, Sang Ki ^a   Lee, Hai Young ^a  

^a Ajou University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COMPUTATIONAL METHODS; ELECTRIC NETWORK ANALYSIS; ELECTRIC RESISTANCE; IMPEDANCE MATCHING (ELECTRIC); INTEGRATED CIRCUITS; MATHEMATICAL MODELS;

DOUBLE BONDING WIRES; HIGH FREQUENCY INTEGRATED CIRCUIT PACKAGING; MUTUAL INDUCTANCE; PARALLEL BONDING WIRES; PARASITIC IMPEDANCE;

ELECTRONICS PACKAGING;

EID: 0029379296     PISSN: 10518207     EISSN: None     Source Type: Journal    
DOI: 10.1109/75.410403     Document Type: Article

References (6)

1. Proc. IEEE MTT-S Int. Microwave Symp., Joint Workshop on New Packaging Techniques for MMIC’s and Discrete Devices and Loss, Crosstalk, and Package Effects in Microwave and Millimeter-Wave Integrated Circuits, Boston, MA, 1991.
2. H.-Y. Lee, “Wideband characterization of a typical bonding wire for microwave and millimeter-wave integrated circuits,” IEEE Trans. Microwave Theory Tech., vol. 43, pp. 63-68, Jan. 1995.
3. H.-Y. Lee, “Widedand characterization of mutual coupling between high density bonding wires,” IEEE Microwave and Guided Wave Lett., vol. 4, no. 8, pp. 265-267, Aug. 1994.
4. W. L. Stutzman and G. A. Thiel, Antenna Theory and Design. New York: Wiley, 1981.
5. F. E. Gardiol, Lossy Transmission Lines Dedham, MA: Artech House, 1987.
6. C. S. Walker, Capacitance, Inductance and Crosstalk Analysis. Dedham, MA: Artech House, 1990.