New insight on electromigration failure mechanism and its impact on design guidelines

Digest of Technical Papers - Symposium on VLSI Technology

Volumn , Issue , 1997, Pages 39-40

  Jawarani, D ^a   Gall, M ^a   Hernandez, R ^a   Capasso, C ^a   Kawasaki, H ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COPPER; DIFFUSION IN SOLIDS; DISSOLUTION; ELECTROMIGRATION; INTEGRATED CIRCUIT LAYOUT; PRECIPITATION (CHEMICAL); THERMAL EFFECTS;

ELECTROMIGRATION FAILURE MECHANISM;

VLSI CIRCUITS;

EID: 0030719744     PISSN: 07431562     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/vlsit.1997.623684     Document Type: Conference Paper

References (4)