Measurements of mechanical stress drift in ic plastic packages using the piezo-Hall effect

European Solid-State Device Research Conference

Volumn 13-15 Sept. 1999, Issue , 1999, Pages 256-259

  Manic, D ^a   Popovic, R S ^a   Petr, J ^b  

^a EPFL   (Switzerland)

^b Siemens Schweiz AG   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

HALL EFFECT;

IN-PLANE NORMAL STRESS; MEASUREMENT-BASED; MEASUREMENTS OF; MECHANICAL STRESS; PACKAGING STRESS; PIEZO-HALL EFFECTS; PLASTIC PACKAGES; TEMPERATURE CYCLING;

STRESSES;

EID: 84907888021     PISSN: 19308876     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. H. Miura et al., "Thermal Stress Measurement in Silicon Chips in IC Plastic Packages Under Temperature Cycling", J Elec. Pack, vol. 115, pp. 9-15, 1993.
2. Y. Kanda, "A Graphical Representation of the Piezoresistance Coefcients in Silicon, " IEEE Trans. on EDs, vol. 29, pp. 64-70, 1982.
3. A. Hamada et al., "A New Aspect of Mechanical Stess Effect in Scaled MOS Devices, " IEEE Trans. on EDs, vol. 38, No.4, pp. 895-900, 1991.
4. Y. Kanda, "Effects of Stress on Germanium and Silicon P-N Junctions", Jpn. J Appl. Phys., vol.6, pp. 475-86, 1967.
5. B. Halg, "Piezo-Hall coefcients of n-type silicon", J Appl. Phys., vol. 64, pp. 276-82, 1988.
6. Y. Zou, et al., "Three-Dimensional Die Surface Stress. Measurements in Delaminated and Non-Delaminated Plastic Packages", Proc. of 48th Elec. Components and Technolog Conj, pp. 1223-34, 1998.
7. R.S. Popovic, Hall Efect Devices, Adam Hilger, Bristol, 1991.