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Physica B: Condensed Matter

Volumn 283, Issue 1-3, 2000, Pages 125-129

X-ray measurements of the depth dependence of stress in gold films

(4) Brennan, S a Munkholm, A b Leung, O S c Nix, W D c

a SLAC NATIONAL ACCELERATOR LABORATORY (United States)

b ARGONNE NATIONAL LABORATORY (United States)

c Stanford University (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; EVAPORATION; GOLD; RESIDUAL STRESSES; SILICON WAFERS; STRAIN; STRESS ANALYSIS; THERMAL CYCLING; THERMAL EXPANSION; X RAY SCATTERING;

THERMAL EXPANSION COEFFICIENT;

METALLIC FILMS;

EID: 0033731379 PISSN: 09214526 EISSN: None Source Type: Journal
DOI: 10.1016/S0921-4526(99)01904-3 Document Type: Article

Times cited : (13)

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