SCOPUS 정보 검색 플랫폼

Volumn 566, Issue , 1999, Pages 73-79

CMP fundamentals and challenges

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS INDUSTRY; INDUSTRIAL APPLICATIONS; METALS; SEMICONDUCTOR DEVICE MANUFACTURE; SILICA; TECHNOLOGY;

CHEMICAL MECHANICAL POLISHING; SEMICONDUCTOR POLISHING TECHNOLOGY;

CHEMICAL POLISHING;

EID: 0033728349 PISSN: 02729172 EISSN: None Source Type: Conference Proceeding
DOI: 10.1557/proc-566-73 Document Type: Article

Times cited : (5)

References (12)

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2
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3
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- Brown, N.¹ Cook, L.M.²

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- Ouma, D.¹ Boning, D.² Chung, J.³ Shinn, O.⁴ Olsen, L.⁵ Clark, J.⁶

6
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- F. B. Kaufman, D. B. Thompson, R. E. Broadie, M. A. Jaso, W. L. Guthrie, D. J. Pearson, and M. B. Small, Journal of the Electrochemical Society 138, p. 3460 (1991).
- (1991) Journal of the Electrochemical Society , vol.138 , pp. 3460
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7
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- Stein, D.J.¹ Hetherington, D.L.² Cecchi, J.L.³

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- Steigerwald, J.M.¹ Murarka, S.P.² Gutmann, R.J.³

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- L. M. Cook and G. W. Wu, Proceedings of the Chemical Mechanical Planarization for ULSI Multilevel Interconnect Conference, p. 150, 1998.
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