New methodology for microwave/millimeter-wave MMIC development

IEEE MTT-S International Microwave Symposium Digest

Volumn 3, Issue , 2000, Pages 1913-1916

  Kamogawa, Kenji ^a   Nishikawa, Kenjiro ^a   Toyoda, Ichihiko ^a   Tokumitsu, Masami ^a   Hirano, Makoto ^a   Nakagawa, Tadao ^a   Muraguchi, Masahiro ^a  

^a NTT Network Innovation Laboratories   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

THIN POLYIMIDE INTERCONNECTION TECHNOLOGY; THREE DIMENSIONAL MULTILAYER INTERCONNECTION PROCESS;

CAPACITORS; COMPUTER AIDED DESIGN; HIGH ELECTRON MOBILITY TRANSISTORS; INTEGRATED CIRCUIT LAYOUT; INTERCONNECTION NETWORKS; POLYIMIDES;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0033724439     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (4)

1. T. Tokumitsu, M. Hirano, K. Yamasaki, C. Yamaguchi, K. Nishikawa, and M. Aikawa, "Highly Integrated Three-Dimensional MMIC Techndogy Appiled to Novel Masterslice GaAs- and Si-MMIC's," IEEE Journal of Solid State Circuits, Vol. 32, No. 9, pp. 1334-1341, Sept. 1997.
2. K. Nishikawa, I. Toyoda, K. Kamogawa, T. Tokumitsu, and M. Tanaka, "Three-Dimensional Monolithic Microwave Integrated Circuit Technology for Fully Computer-Aided Design-Compatible Monolithic Microwave Integrated Circuit Development, International Journal of RF and Microwave CAE, Vol. 8, No. 6, pp. 498-506, Nov. 1998
3. H. Takenaka and D. Ueda, "0.15μm T-sharped Gate Fabrication for GaAs MODFET Using Phase Shift Lithography," IEEE Trans. Electron Devices, Vol. 43, No. 2, pp. 238-244, Feb. 1996.
4. M. Hirano, K. Nishikawa, I. Toyoda, S. Aoyama, S. Sugitani. and K. Yamasaki, "Three-Dimensional Passive Circuit Technology For Ultra-Compact MMIC's, " IEEE Trans. Microwave Theory and Tech., vol. 43, no. 12, Dec. 1995.