0.4 μm diameter nickel- filament silicone-matrix resilient composites for electromagnetic interference shielding

Journal of Electronic Packaging, Transactions of the ASME

Volumn 119, Issue 4, 1997, Pages 236-238

  Shui, Xiaoping ^a   Chung, D D L ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CABLES; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTROMAGNETIC WAVE INTERFERENCE; ELECTRONICS PACKAGING; NONMETALLIC MATRIX COMPOSITES; SILICONES;

NICKEL FILAMENTS; RESILIENT COMPOSITES;

ELECTROMAGNETIC SHIELDING;

EID: 0031367476     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792242     Document Type: Article

References (5)

1. Jana, P. B., 1993, Plastics, Rubber, and Composites Processing and Applications, Vol. 20, pp. 107-118.
2. Kost, J., Narkis, M., and Foux, A., 1983, Polymer Engineering Science, Vol. 23, No. 10, pp. 567-571.
3. Radhakrishnan, S., and Saini, D. R., 1991, Journal of Materials Science, Vol. 26, pp. 5950-5956.
4. Shui, X., and Chung, D. D. L., 1995, Journal of Electronic Materials, Vol. 24, No. 2, pp. 107-113.
5. Zhu, M., and Chung, D. D. L., 1991, ASME Journal of Electronic Packaging, Vol. 113, pp. 417-420