A study of the high frequency performance of thin film capacitors for electronic packaging

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 2, 2000, Pages 293-302

  Chen, K Y ^a   Brown, William D ^a   Schaper, Leonard W ^a   Ang, Simon S ^b   Naseem, Hameed A ^b  

^a TEXAS INSTRUMENTS   (United States)

^b 3202 Bell Engineering Center   (United States)

Author keywords

Computer modeling and simulation; Decoupling capacitors; Electronic packaging; Finite element method; High frequency performance; Parasitic inductance; Parasitic resistance; Thin film capacitors

Indexed keywords

DECOUPLING CAPACITORS; HIGH FREQUENCY PERFORMANCE; PARASITIC INDUCTANCE; PARASITIC RESISTANCE;

CAPACITANCE; COMPUTER SIMULATION; ELECTRIC IMPEDANCE; ELECTRIC POWER DISTRIBUTION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; INTEGRATED CIRCUITS; PERFORMANCE; THIN FILM DEVICES;

CAPACITORS;

EID: 0033716498     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.846648     Document Type: Article

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