Analysis of Microwave Capacitors and IC Packages

IEEE Transactions on Microwave Theory and Techniques

Volumn 42, Issue 9, 1994, Pages 1759-1764

  Beker, Benjamin ^a   Cokkinides, George ^b   Templeton, Allen ^b  

^a UNIVERSITY OF SOUTH CAROLINA   (United States)

^b AVX CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE MEASUREMENT; CAPACITORS; COMPUTATIONAL COMPLEXITY; ELECTRIC PROPERTIES; FINITE DIFFERENCE METHOD; INDUCTANCE MEASUREMENT; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUITS; MATHEMATICAL MODELS; MICROWAVE DEVICES; THREE DIMENSIONAL;

CURRENT SIMULATION METHOD; DECOUPLING CAPACITORS; MICROWAVE CAPACITORS; THREE DIMENSIONAL GEOMETRIES;

ELECTRIC NETWORK ANALYSIS;

EID: 0028494787     PISSN: 00189480     EISSN: 15579670     Source Type: Journal    
DOI: 10.1109/22.310585     Document Type: Article

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