New fabrication process for planar thin-film multijunction thermal converters

CPEM Digest (Conference on Precision Electromagnetic Measurements)

Volumn , Issue , 2000, Pages 387-388

  Wunsch, T F ^a   Kinard, J R ^a,b   Manginell, R P ^a   Lipe, T E ^b   Jungling, K C ^c  

^a SANDIA NATIONAL LABORATORIES   (United States)

^b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^c UNIVERSITY OF NEW MEXICO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DIELECTRIC MATERIALS; ELECTRIC CONDUCTIVITY; ETCHING; THERMOCOUPLES; THIN FILMS;

MULTIJUNCTION THERMAL CONVERTERS;

ELECTRIC CONVERTERS;

EID: 0033714842     PISSN: 05891485     EISSN: None     Source Type: Journal    
DOI: 10.1109/19.918134     Document Type: Article

References (4)

1. J. Kinard D. Novotny T. Lipe D. Huang Development of thin-film multijunction thermal converters at NIST IEEE Trans. Instrum. Meas. 46 347 351 Apr. 1997 19 12386 571853
2. Method of anisotropically etching silicon 26 Mar. 1996 Franz Laermer and Andrea Schilp, Robert Bosch GmbH Patent 5󈔕󈚝
3. M. Klonz T. Weimann Accurate thin-film multijunction thermal converter on a silicon chip IEEE Trans. Instrum. Meas. 38 335 337 Apr. 1989 19 4957 192301
4. A. Corazza R. Kullberg Vacuum maintenance in hermetically sealed MEM's packages Proc. SPIE Conf. Micromachined Devices and Components 82 89 Proc. SPIE Conf. Micromachined Devices and Components Santa Clara CA 1998-Sept.