Metallurgical Reactions at the Interface of Sn/Pb Solder and Electroless Copper-Plated A1N Substrate

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 18, Issue 3, 1995, Pages 537-542

  Chang, Jiann Haur ^b   Duh, Jenq Gong ^b  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER PLATING; ELECTROLESS PLATING; ELECTRON DIFFRACTION; INTERFACES (MATERIALS); INTERMETALLICS; LEAD ALLOYS; NITRIDES; RECRYSTALLIZATION (METALLURGY); SOLDERING ALLOYS; SUBSTRATES; TIN ALLOYS; X RAY DIFFRACTION;

ADHESION STRENGTH; ALUMINUM NITRIDE; INTERMETALLIC FORMATION;

ELECTRONICS PACKAGING;

EID: 0029359651     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.404113     Document Type: Article

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