Need to incorporate the real micro-contact distribution in spreading resistance correction schemes

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 18, Issue 1, 2000, Pages 393-400

  Clarysse, T ^a   Vandervorst, W ^a,b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; APPROXIMATION THEORY; BOUNDARY CONDITIONS; COMPUTER SIMULATION; ELECTRIC CONDUCTIVITY OF SOLIDS; MATHEMATICAL MODELS; MULTILAYERS; OHMIC CONTACTS; SEMICONDUCTING FILMS; SEMICONDUCTING SILICON; SURFACE ROUGHNESS;

SPREADING RESISTANCE PROBE (SRP) MICROCONTACT MODEL;

ELECTRIC RESISTANCE MEASUREMENT;

EID: 0033684852     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.591202     Document Type: Article

References (14)

1. M. Pawlik, J. Vac. Sci. Technol. B 10, 388 (1992).
2. P. J. Severin, Spreading Resistance Symposium (NBS, Washington, DC, 1974), Vol. 400-10, p. 99.
3. R. G. Mazur and D. H. Dickey, J. Electrochem. Soc. 113, 255 (1966).
4. P. A. Schumann and E. E. Gardner, J. Electrochem. Soc. 116, 87 (1969).
5. P. Kramer and L. J. Van Ruyven, Solid-State Electron. 15, 757 (1972).
6. T. Clarysse and W. Vandervorst, J. Vac. Sci. Technol. B 18, 369 (2000).
7. T. Clarysse and W. Vandervorst, J. Vac. Sci. Technol. B 10, 432 (1992).
8. T. Clarysse and W. Vandervorst, J. Vac. Sci. Technol. B 12, 290 (1994).
9. T. Clarysse, P. De Wolf, H. Bender, and W. Vandervorst, J. Vac. Sci. Technol. B 14, 358 (1996).
10. W. Vandervorst, T. Clarysse, and H. E. Smith, J. Vac. Sci. Technol. B 14, 404 (1996).
11. J. A. Greenwood, Br. J. Appl. Phys. 17, 1621 (1966).
12. R. Holm, Wiss. Veröff Siemens-Werken 7, 217 (1929).
13. ISE Integrated System Engineering, ETH-Zentrum, ETZ Zurich, Switzerland.
14. IMECPROF, a professional SRP package, IMEC, Belgium.