Effect of the mole ratios of silane-modified polyvinylimidazoles on adhesion promotion of the polyimide/ copper system

Journal of Adhesion Science and Technology

Volumn 12, Issue 3, 1998, Pages 323-337

  Jang, Jyongsik ^a   Jang, Inkook ^a   Kim, Hyuncheol ^a  

^a Seoul National University   (South Korea)

Author keywords

Copolymer composition; Copper; Lap shear strength; PI Cu interface; Polyimide; Silane modified PVI

Indexed keywords

CONTACT ANGLE; COPPER; INTERFACES (MATERIALS); POLYIMIDES; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SILANES; VINYL RESINS; ADHESION; BOND STRENGTH (MATERIALS); COPOLYMERS; FOURIER TRANSFORM INFRARED SPECTROSCOPY;

PROMOTERS;

ADHESION; COPPER;

ADHESION PROMOTER; ADHESION PROMOTION; BONDING TEMPERATURES; COPOLYMER COMPOSITIONS; COPPER SYSTEMS; FOURIER TRANSFORM INFRARED; INTERFACIAL ADHESION STRENGTH; INTERFACIAL PHENOMENA; LAP SHEAR STRENGTH; LAP SHEAR TESTS; MOLE FRACTION; MOLE RATIO; SCANNING ELECTRON MICROSCOPIC; SILANE-MODIFIED PVI; THERMO-OXIDATIVE DEGRADATION; VINYLTRIMETHOXYSILANES;

EID: 0031652901     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856198X00902     Document Type: Article

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