Adhesion improvement of epoxy resin to alloy 42 lead frame by silane coupling agents

Journal of Adhesion Science and Technology

Volumn 11, Issue 6, 1997, Pages 797-809

  Song, S M ^a   Park, C E ^a   Yun, H K ^b   Oh, S Y ^b   Park, J M ^b  

^a Pohang University of Science and Technology (POSTECH)   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

Adhesion strength; Alloy 42 lead frame; Epoxy resin; Moisture absorption; Silane coupling agent

Indexed keywords

BOND STRENGTH (MATERIALS); CHEMICAL VAPOR DEPOSITION; ELECTRONICS PACKAGING; EPOXY RESINS; GAS ABSORPTION; MOISTURE; SILANES; SOLUTIONS; THERMODYNAMIC STABILITY; THERMOGRAVIMETRIC ANALYSIS; WATER ABSORPTION; ADHESION; ALLOYS; DURABILITY; RESINS; SILICON COMPOUNDS;

EPOXY MOLDING COMPOUND; LEAD FRAME; SILANE COUPLING AGENTS;

ADHESION; COUPLING AGENTS;

ADHESION IMPROVEMENT; AMINOPROPYLTRIETHOXYSILANE; AMINOPROPYLTRIMETHOXYSILANE; DIFFERENT GEOMETRY; HIGH-HUMIDITY ENVIRONMENT; LEAD FRAME; MOISTURE ABSORPTION; OPTIMUM CONCENTRATION; SILANE COUPLING AGENT; VAPOR PHASE DEPOSITION;

EID: 0030697548     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856197X00921     Document Type: Article

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