Mechanical properties of electroplated copper thin films

Materials Research Society Symposium - Proceedings

Volumn 594, Issue , 2000, Pages 63-68

  Spolenak, R ^a   Volkert, C A ^a,b   Takahashi, K ^a   Fiorillo, S ^a   Miner, J ^a   Brown, W L ^a  

^a LUCENT TECHNOLOGIES   (United States)

^b MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ANODIC OXIDATION; CHEMICAL POLISHING; CRYSTAL MICROSTRUCTURE; ELECTROPLATED PRODUCTS; GRAIN SIZE AND SHAPE; MECHANICAL PROPERTIES; SPUTTER DEPOSITION; STRESS ANALYSIS; THIN FILMS; X RAY CRYSTALLOGRAPHY; YIELD STRESS;

CHEMICAL-MECHANICAL POLISHING; ELECTROPLATED COPPER THIN FILMS;

METALLIC FILMS;

EID: 0033657724     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

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