Grain boundary effects on the fatigue deformation and cracking behavior of copper bicrystals

International Journal of Fatigue

Volumn 20, Issue 6, 1998, Pages 463-469

  Hu, Y M ^a   Wang, Z G ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Copper bicrystals; Cracking; Fatigue deformation; Grain boundary

Indexed keywords

COPPER; CRACK PROPAGATION; CRYSTALS; DEFORMATION; GRAIN BOUNDARIES; MICROCRACKS; STRAIN; STRESSES;

COPPER BICRYSTAL; CYCLIC HARDENING; FATIGUE DEFORMATION; INTERGRANULAR CRACKING;

FATIGUE TESTING;

EID: 0032119459     PISSN: 01421123     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0142-1123(98)00014-0     Document Type: Article

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