Fatigue crack initiation and fracture behavior of a copper bicrystal with a perpendicular grain boundary

Materials Science and Engineering: A

Volumn 269, Issue 1-2, 1999, Pages 136-141

  Zhang, Z F ^a   Wang, Z G ^a   Hu, Y M ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Copper bicrystal; Cyclic deformation; Fractography; Grain boundary; Intergranular cracking

Indexed keywords

CRACK INITIATION; FATIGUE OF MATERIALS; FRACTOGRAPHY; GRAIN BOUNDARIES; NUCLEATION; POLYCRYSTALS;

AXIAL PLASTIC STRAINS; COPPER BICRYSTALS; INTERGRANULAR CRACKING;

COPPER;

EID: 0000332960     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0921-5093(99)00149-5     Document Type: Article

References (10)

1. W.H. Kim, C. Laird, Acta Metall. 26 (1978) 789.
2. L.C. Lim, Y.K. Tay, H.S. Fong, Acta Metall. Mater. 38 (1990) 595.
3. W. Liu, M. Bayerlein, H. Mughrabi, A. Day, P.N. Quested, Acta Metall. Mater. 40 (1992) 1763.
4. Y.M. Hu, Z.G. Wang, Scripta Mater. 34 (1996) 1019.
5. Y.M. Hu, Z.G. Wang, Acta Mater. 45 (1997) 2655.
6. P. Peralta, C. Laird, Acta Mater. 46 (1998) 2001.
7. Z.F. Zhang, Z.G. Wang, S.X. Li, Fatigue Fract. Eng. Mater. Struct. 21 (1998) 1307.
8. Z.F. Zhang, Z.G. Wang, Phil. Mag. 79A (1999) 741.
9. H. Mughrabi, F. Ackermann, K. Herz, ASTM STP 811 (1983) 5.
10. H.-J. Christ, Mater. Sci. Eng. A117 (1989) L25.