Interfacial reaction between Sn-Ag-based solder alloys and substrates

Journal of the Korean Physical Society

Volumn 35, Issue SUPPL. 2, 1999, Pages

  Choi, Won Kyoung ^a   Lee, Hyuck Mo ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0033415633     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

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6. D. R. Frear, W. B. Jones and K. R. Kinsman, Solder Mechanics (TMS, Warrendale, PA, 1991).
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8. R. Meagher, D. Schwarcz and M. Ohring, J. Mater. Sci. 31, 5479 (1996).
9. J. S. Park and S. R. Lee, J. Korea Inst. Metals 34, 965 (1996).