Cooling strategies for embedded electronic components of wearable computers fabricated by shape deposition manufacturing

Thermal Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1996, Pages 13-20

  Egan, Eric ^a   Amon, Cristina H ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MATERIALS; COOLING; HEAT CONDUCTION; HEAT LOSSES; HEAT RESISTANCE; MATHEMATICAL MODELS; PERSONAL COMPUTERS; PORTABLE EQUIPMENT; SUBSTRATES;

EMBEDDED ELECTRONIC COMPONENTS; SHAPE DEPOSITION MANUFACTURING; WEARABLE COMPUTERS;

ELECTRONICS PACKAGING;

EID: 0029694711     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)